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Taiwan excellence to drive India's tech future @ Taiwan Expo 2025

India, Sept. 15 -- Taiwan Excellence (TE), an initiative of Taiwan's Ministry of Economic Affairs (MOEA), is set to deliver an extraordinary showcase of world-class innovation at the Taiwan Excellence... Read More


Soaring inference AI demand triggers severe nearline HDD shortages

India, Sept. 15 -- TrendForce's latest investigations reveal that the massive data volumes generated by AI are straining the global infrastructure of data center storage. Nearline HDDs, traditionally ... Read More


FIA selects Siemens as official Digital Twin sponsor

India, Sept. 15 -- Siemens Digital Industries Software has been selected by the Federation Internationale de l'Automobile (FIA) as "Official Digital Twin Sponsor", as the global governing body for mot... Read More


Is Software Engineering Dead?

India, Sept. 15 -- Here's a software story with a corporate twist: The CEO asked for a "quick demo" of the new AI-powered software deployment system. The software engineering team triggered the demo. ... Read More


SG Bats and Salesforce unite to digitise India's cricket equipment sector

India, Sept. 15 -- Sanspareils Greenlands (SG), India's leading cricket and sports equipment manufacturer, and Salesforce has announced a strategic collaboration to digitise SG Cricket's trade channel... Read More


L&T Semiconductor acquires power module design assets of Fujitsu

India, Sept. 15 -- L&T Semiconductor Technologies Ltd (LTSCT), a wholly-owned subsidiary of Larsen & Toubro, has acquired the Power Module Design Assets of Fujitsu General Electronics Ltd (FGEL) of Ja... Read More


Silex announces Wi-Fi 6E tri-band embedded module based on NXP IW623 chipset

India, Sept. 11 -- Silex Technology America, a global provider of secure and reliable wireless solutions, announced the launch of the SX-SDMAX6E, the embedded module based on NXP Semiconductors ' IW62... Read More


Intel collaborates with LG Innotek to implement an AI-powered smart factory

India, Sept. 11 -- In the world of precision component manufacturing - just think of the tiny parts in modern cell phones, vehicle displays, and other smart devices - reproducing the same part hundred... Read More


SAL receives Applied Materials PECVD tool for 200mm dielectrics thin films deposition

India, Sept. 10 -- Silicon Austria Labs (SAL) has received its Centura PECVD tool from Applied Materials, supporting dielectrics deposition for RF circulators on 200mm wafers. The tool is in commissio... Read More


AGC participating in "JOINT3" Consortium to develop next-gen semiconductor packaging

India, Sept. 10 -- AGC Inc. has joined the "JOINT3" Consortium to develop next-generation semiconductor packaging. JOINT3 is a co-creation evaluation framework established by Resonac, with the aim of... Read More